Black One Component Underfill adhesive for CSP and BGA

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10 Piece/Pieces (Min. Order)
Supply Ability:
10 Ton/Tons per Month
Port:
QINGDAO
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Overview
Quick Details
Other Names:
Underfill adhesives
Place of Origin:
Shandong, China (Mainland)
Classification:
Other Adhesives
Main Raw Material:
Epoxy
Usage:
Packing, Electronic
Brand Name:
Darbond
Model Number:
6588
Color:
Black
Worklife:
7 days
Viscosity(25 degrees C):
950cPs
TG(degrees C):
60
CTE(ppm/℃):
68
Curing:
1min@150 degrees C, 3min@120 degrees C
Packaging & Delivery
Packaging Details
30ml EFD tube, 250ml bottle
Delivery Time
15 days

Specifications

1.Underfill adhesive,black,one component
2.Reworkable, fast cure
3.Underfill for CSP and BGA.

Darbond® Underfill Adhesive

Product

6518

6519

6580

Color

Black

Light Green

Black

Worklife

7 days

7 days

7 days

Viscosity(25°C)

950cPs

1100cPs

340cPs

Curing Condition

1min@150°C

3min@120°C

3min@150°C

6min@120°C

10min@130°C

20min@110°C

Tg(°C)

60

50

76

CTE ppm/°C

68

68

52

Shelf Life

6months@2-8°C

6months@2-8°C

6months@2-8°C

package

30ml

250ml

30ml

250ml

85ml

300ml

 

Darbond® Underfill Adhesive 6518

1. One-component, black, heat curing epoxy liquid filling material.

2. Fast curing at 120°C.

3. Repairable

4. Good flowability.

5. Permeate gap less than 25μm fast

6. Mainly designed for protecting assembled CSP/BGA/uBGA

 

Darbond® Underfill Adhesive 6519

1. One-component, black, heat curing epoxy liquid filling material.

2. Fast curing at 120°C.

3. Repairable

4. Good flowability.

5. Permeate gap less than 25μm fast

6. Mainly designed for protecting assembled CSP/BGA/uBGA

 

Darbond® Underfill Adhesive 6580

1. One-component, black, heat curing epoxy liquid filling material.

2. Curing at 110°C.

3. Excellent repairability.

4. Excellent flexibility.

5. Excellent flowability.

6. Permeate gap less than 25μm fast

7. Mainly designed for protecting assembled CSP/BGA/uBGA