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Quick Details

  • Other Names: Underfill adhesives
  • Place of Origin: Shandong, China (Mainland)
  • Classification: Other Adhesives
  • Main Raw Material: Epoxy
  • Usage: Packing, Electronic
  • Brand Name: Darbond
  • Model Number: 6588
  • Color: Black
  • Worklife: 7 days
  • Viscosity(25 degrees C): 950cPs
  • TG(degrees C): 60
  • CTE(ppm/℃): 68
  • Curing: 1min@150 degrees C, 3min@120 degrees C

Packaging & Delivery

Packaging Details 30ml EFD tube, 250ml bottle
Delivery Time 15 days

Specifications

1.Underfill adhesive,black,one component
2.Reworkable, fast cure
3.Underfill for CSP and BGA.

Darbond® Underfill Adhesive

Product

6518

6519

6580

Color

Black

Light Green

Black

Worklife

7 days

7 days

7 days

Viscosity(25°C)

950cPs

1100cPs

340cPs

Curing Condition

1min@150°C

3min@120°C

3min@150°C

6min@120°C

10min@130°C

20min@110°C

Tg(°C)

60

50

76

CTE ppm/°C

68

68

52

Shelf Life

6months@2-8°C

6months@2-8°C

6months@2-8°C

package

30ml

250ml

30ml

250ml

85ml

300ml

 

Darbond® Underfill Adhesive 6518

1. One-component, black, heat curing epoxy liquid filling material.

2. Fast curing at 120°C.

3. Repairable

4. Good flowability.

5. Permeate gap less than 25μm fast

6. Mainly designed for protecting assembled CSP/BGA/uBGA

 

Darbond® Underfill Adhesive 6519

1. One-component, black, heat curing epoxy liquid filling material.

2. Fast curing at 120°C.

3. Repairable

4. Good flowability.

5. Permeate gap less than 25μm fast

6. Mainly designed for protecting assembled CSP/BGA/uBGA

 

Darbond® Underfill Adhesive 6580

1. One-component, black, heat curing epoxy liquid filling material.

2. Curing at 110°C.

3. Excellent repairability.

4. Excellent flexibility.

5. Excellent flowability.

6. Permeate gap less than 25μm fast

7. Mainly designed for protecting assembled CSP/BGA/uBGA

Transaction History of the Supplier

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